|
aHR0cDovL2ZyZWVzaGlwLmNvLmty
- ±Ù¿ø: CN (Á¤Ç°)
- Model Number: A8-4500M
AMD A8-4500M specifications
General information
|
Type
|
CPU / Microprocessor
|
Market segment
|
Mobile
|
Family
|
AMD A8-Series for Notebooks
|
Model number
|
A8-4500M
|
CPU part number
|
|
Frequency
|
1900 MHz
|
Maximum turbo frequency
|
2800 MHz
|
Boosted P states [1]
|
#1: 2800 MHz, 0.925V
#2: 2300 MHz, 0.7V
|
Package
|
722-pin organic lidless micro Pin Grid Array (UOL722)
|
Socket
|
Socket FS1 (FS1r2)
|
Size
|
1.38" x 1.38" / 3.5cm x 3.5cm
|
Weight
|
0.2oz / 6g
|
Introduction date
|
May 15, 2012
|
Architecture / Microarchitecture
|
Microarchitecture
|
Piledriver
|
Platform
|
Comal
|
Processor core
|
Trinity
|
Core stepping
|
TN-A1
|
CPUID
|
610F01
|
Manufacturing process
|
0.032 micron
1303 million transistors
|
Die
|
246mm2
|
Data width
|
64 bit
|
The number of CPU cores
|
4
|
The number of threads
|
4
|
Floating Point Unit
|
Integrated (shared between two cores in each module)
|
Level 1 cache size
|
2 x 64 KB 2-way set associative shared instruction caches
4 x 16 KB 4-way set associative data caches
|
Level 2 cache size
|
2 x 2 MB 16-way set associative shared exclusive caches
|
Level 3 cache size
|
None
|
Cache latency
|
3 (L1 cache)
|
Multiprocessing
|
Uniprocessor
|
Extensions and Technologies
|
-
MMX instructions
-
Extensions to MMX
-
SSE / Streaming SIMD Extensions
-
SSE2 / Streaming SIMD Extensions 2
-
SSE3 / Streaming SIMD Extensions 3
-
SSSE3 / Supplemental Streaming SIMD Extensions 3
-
SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4
-
SSE4a
-
AES / Advanced Encryption Standard instructions
-
AVX / Advanced Vector Extensions
-
BMI1 / Bit Manipulation instructions 1
-
F16C / 16-bit Floating-Point conversion instructions
-
FMA3 / 3-operand Fused Multiply-Add instructions
-
FMA4 / 4-operand Fused Multiply-Add instructions
-
TBM / Trailing Bit Manipulation instructions
-
XOP / eXtended Operations instructions
-
AMD64 / AMD 64-bit technology
-
AMD-V / AMD Virtualization technology
-
EVP / Enhanced Virus Protection
-
Turbo Core 3.0 technology
|
Low power features
|
-
Core C1, C1E, C6 and CC6 states
-
Package S3, S4 and S5 states
-
PowerNow!
|
Low power P states [1]
|
#1: 1800 MHz, 0.375V
#2: 1700 MHz, 0.275V
#3: 1600 MHz, 0.225V
#4: 1400 MHz, 0.175V
#5: 900 MHz, 0.175V
|
Integrated peripherals / components
|
Integrated graphics
|
GPU Type: Radeon HD 7640G
Shader cores: 256
Base frequency (MHz): 496
Maximum frequency (MHz): 685
|
Memory controller
|
The number of controllers: 1
Memory channels: 2
Supported memory: DDR3-1600, DDR3L-1600, DDR3U-1333
Maximum memory bandwidth (GB/s): 25.6
|
Other peripherals
|
|
Electrical / Thermal parameters
|
V core
|
0.8125V - 1.3V
|
Maximum operating temperature
|
100¡ÆC
|
Thermal Design Power
|
35 Watt
|
|
|
|
|
|