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- Model Number: X3440
Intel Xeon X3440 specifications
General information
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Type
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Market segment
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Server
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Family
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Model number
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CPU part numbers
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Frequency
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2533 MHz
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Maximum turbo frequency
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2933 MHz (1 core)
2800 MHz (2 cores)
2667 MHz (3 or 4 cores)
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Bus speed
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2.5 GT/s DMI
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Clock multiplier
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19
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Package
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1156-land Flip-Chip Land Grid Array (FC-LGA8)
1.48" x 1.48" (3.75 cm x 3.75 cm)
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Socket
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Introduction date
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End-of-Life date
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Last order date is December 28, 2012
Last shipment date for tray processors is December 6, 2013
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Price at introduction
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$215
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S-spec numbers
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Part number
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ES/QS processors
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Production processors
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BV80605002517AQ
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+
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+
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BX80605X3440
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+
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Architecture / Microarchitecture
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Microarchitecture
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Nehalem
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Platform
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Foxhollow-WS
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Processor core
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Core stepping
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B1 (Q3AS, SLBLF)
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CPUID
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106E5 (SLBLF)
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Manufacturing process
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0.045 micron
774 million transistors
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Die
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296mm2
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Data width
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64 bit
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The number of CPU cores
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4
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The number of threads
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8
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Floating Point Unit
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Integrated
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Level 1 cache size
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4 x 32 KB 4-way set associative instruction caches
4 x 32 KB 8-way set associative data caches
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Level 2 cache size
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4 x 256 KB 8-way set associative caches
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Level 3 cache size
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8 MB 16-way set associative shared cache
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Physical memory
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32 GB
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Multiprocessing
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Uniprocessor
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Extensions and Technologies
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MMX instructions
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SSE / Streaming SIMD Extensions
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SSE2 / Streaming SIMD Extensions 2
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SSE3 / Streaming SIMD Extensions 3
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SSSE3 / Supplemental Streaming SIMD Extensions 3
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SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4
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EM64T / Extended Memory 64 technology / Intel 64
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NX / XD / Execute disable bit
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HT / Hyper-Threading technology
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VT-x / Virtualization technology
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VT-d / Virtualization for directed I/O
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TBT / Turbo Boost technology
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TXT / Trusted Execution technology
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Low power features
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Thread C1/C1E, C3 and C6 states
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Core C1/C1E, C3 and C6 states
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Package C1/C1E, C3 and C6 states
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Enhanced SpeedStep technology
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Integrated peripherals / components
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Integrated graphics
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None
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Memory controller
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The number of controllers: 1
Memory channels: 2
Supported memory: DDR3-800, DDR3-1066, DDR3-1333
Maximum memory bandwidth (GB/s): 21.3
ECC supported: Yes
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Other peripherals
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Electrical / Thermal parameters
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V core
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0.65V - 1.4V
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Maximum operating temperature
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72.7¡ÆC
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Maximum power dissipation
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189.78 Watt (peak)
160.08 Watt (sustained)
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Thermal Design Power
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95 Watt
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